During the IEEE IITC conference in Grenoble, imec and Lam Research presented a novel bottom-up prefill technique for vias and contacts. The technique, based on Electroless Deposition (ELD) of Cobalt (Co), is a highly selective method resulting in void-free filling of via and contact holes. Potentially increasing the circuit performance, it is a promising path to scaling advanced interconnects and enabling future logic and DRAM nodes at the 7 nm node and below.   As logic and memory nodes scale...